**Abstract**
Why do most mainstream manufacturers still use mortar wafer cutting instead of diamond wire cutting technology? The production of photovoltaic modules involves four key stages: polysilicon production, ingot slicing, cell manufacturing, and module assembly. This article focuses on the slicing process, which can be carried out in one or two steps.
The first step is the production of primary polycrystalline silicon used for ingots, including square ingots and round bars. Ingots are produced through three main processes, each resulting in different quality levels. Monocrystalline silicon is the purest form, more expensive, but offers higher efficiency when turned into cells. Polycrystalline silicon has more impurities, lower cost, and moderate efficiency. There's also a new type called "single crystal" that sits between monocrystalline and polycrystalline, but it hasn't gained widespread adoption yet.
Slicing involves cutting polycrystalline silicon ingots into thin wafers. Traditionally, this was done using a steel wire coated with silicon carbide and slurry. However, diamond wire technology has been gaining attention as a potential replacement. Diamond wires are electroplated with diamonds and offer faster cutting speeds, higher productivity, and reduced reliance on costly and difficult-to-handle mortars.
In recent years, there has been much discussion about diamond wire replacing traditional methods, but progress has been slow. In 2012, at the EUPVSEC conference, researchers explored why this transition had not happened, whether the market would shift to diamond wire, and how soon it might occur.
Currently, all wafers are cut using wire-based technology. Over the past decade, the process has remained largely unchanged, with limited opportunities to reduce costs or boost efficiency. However, as the industry expanded and costs increased, companies began looking for alternatives.
Diamond wire has several advantages over steel wire: it cuts faster, increases machine productivity, and reduces consumables. But despite these benefits, its high unit price has been a major barrier. At one point, diamond wire cost over $250–$300 per kilometer, while steel wire was just $1.28 per kilometer.
Today, the cost gap has narrowed slightly. Since diamond wire makes up a larger portion of non-silicon processing costs (over 80%), even small price reductions have a significant impact on total costs. Switching to diamond wire could save about $0.10 per wafer, which, for large producers like Jingao, could translate into millions in annual savings.
However, the transition requires significant capital investment. Most slicing machines need to be replaced, and additional equipment such as cleaning and etching systems must also be upgraded. These costs create hesitation among manufacturers, who are waiting for proven results before making the switch.
Another challenge is supplier risk. While diamond wire has shown promise in cutting single crystals, especially in Japan, it’s not yet fully proven for all types of silicon. Downtime and inconsistencies during the slicing process can offset its efficiency gains.
Despite these challenges, the market is gradually shifting. We predict that by 2020, 69% of wafers will be cut using diamond wire. By 2014, the market share is expected to reach 11%, rising to 43% by 2017. The majority of this growth will come from the single-crystal and monocrystalline segments, where diamond wire is already showing strong performance.
Suppliers like Asahi, JFS, Noritake, and others are expanding their capacity, and new players from Europe and Asia are entering the market. With increasing investment, the adoption of diamond wire is expected to accelerate.
Overall, the shift to diamond wire is driven by both technological advancements and growing demand in the PV sector. According to forecasts, global demand for diamond wire will rise from 300,000 km in 2011 to 34 million km by 2020. This transition is set to reshape the industry in the coming years.
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