CCD is the core device of the camera, so its performance will directly affect the quality of the camera, and the development of the CCD is the basis for the replacement of the camera.
There are two kinds of CCD sensors: the first is a special CCD sensor, such as infrared CCD chip (infrared focal plane array device), high-sensitivity back-illuminated and electron bombarded CCD, EBCCD, etc., in addition to large targets such as 2048×2048 , 4096 × 4096 visible light CCD sensor, wide spectral range (UV → visible light → near infrared light → 3-5μm mid-infrared light → 8-14um far-infrared light) focal plane array sensor. There are currently commercial products and are widely used in various fields.
The second is a general-purpose or consumer CCD sensor, which has made great progress in many aspects. The general direction is to improve the overall performance of the CCD camera.
(1) The development of the image size of the CCD sensor toward the direction of integration and light weight Because of the high cost of manufacturing silicon wafers and processing of CCD sensors, it is hoped that more CCD sensors will be etched out on a 6.5-inch silicon wafer. The chip; Due to the advancement of the lithography machine, the CCD sensor has been developed in the direction of 1/2 inch, 1/3 inch, 1/4 inch, and 1/5 inch while maintaining high sensitivity. In 1993, 1/2-inch CCD sensors accounted for 5% of total production; 1/4-inch CCD sensors accounted for 10% of total production; 1/3-inch CCD sensors accounted for 85% of total production. In 1997, when the total output increased by more than 200% compared with 1993, the 1/2-inch CCD sensor still has great development, accounting for 15% of the total output (1/2 inch due to the large target surface It is needed in many occasions, especially in the field of scientific research; 1/4-inch CCD sensor accounts for 60% of the total output. In other words, the 1/2 inch CCD sensor with a large target size still has a great growth. The output of a 1/4-inch CCD sensor is lower than that of a 1/3-inch CCD sensor.
(2) The development of high-precision, multi-standard CCD sensors has reduced the image size of various CCD sensors, but the number of pixels has increased from the early 512 (H) × 596 (V) to 795 (H) × 596 (V) has developed even more than megapixel CCD sensors. In order to improve the resolving power in the horizontal direction and in the vertical direction, it has progressed from the usual interlace scanning to the progressive scanning format.
(3) Reducing the working voltage of the CCD sensor and reducing the power consumption The CCD camera developed at the initial stage has +24V, +22V, +17V, and +5V, and the current general purpose is +12V. In order to cooperate with the application of PC camera and network image transmission, the two operating voltages are mainly +12V and +5V.
(4) Improving the manufacturing efficiency of CCD cameras To reduce the manufacturing cost of CCD cameras and achieve high-speed automated production, manufacturers are pursuing a compact structure and are committed to the miniaturization of CCD cameras, that is, improved from DipOnBoard (DOB) to process Tin Optoelectronics. (COB) Chip mounting method for connecting IC chips on the board. So far, MultiChipModule (MCM) multichip integrated modular manufacturing technology has been implemented.
(5) Digitization of CCD camera When manufacturing a CCD camera, DSP digital processing is gradually implemented from the analog simulation system of the past, and various parameters of the CCD camera, especially the color CCD camera, can be quantified by means of an electronic computer and a dedicated software system. Adjustment can ensure the optimization of the CCD camera performance indicators and the quantitative modification of parameters under special conditions of use.
There are two kinds of CCD sensors: the first is a special CCD sensor, such as infrared CCD chip (infrared focal plane array device), high-sensitivity back-illuminated and electron bombarded CCD, EBCCD, etc., in addition to large targets such as 2048×2048 , 4096 × 4096 visible light CCD sensor, wide spectral range (UV → visible light → near infrared light → 3-5μm mid-infrared light → 8-14um far-infrared light) focal plane array sensor. There are currently commercial products and are widely used in various fields.
The second is a general-purpose or consumer CCD sensor, which has made great progress in many aspects. The general direction is to improve the overall performance of the CCD camera.
(1) The development of the image size of the CCD sensor toward the direction of integration and light weight Because of the high cost of manufacturing silicon wafers and processing of CCD sensors, it is hoped that more CCD sensors will be etched out on a 6.5-inch silicon wafer. The chip; Due to the advancement of the lithography machine, the CCD sensor has been developed in the direction of 1/2 inch, 1/3 inch, 1/4 inch, and 1/5 inch while maintaining high sensitivity. In 1993, 1/2-inch CCD sensors accounted for 5% of total production; 1/4-inch CCD sensors accounted for 10% of total production; 1/3-inch CCD sensors accounted for 85% of total production. In 1997, when the total output increased by more than 200% compared with 1993, the 1/2-inch CCD sensor still has great development, accounting for 15% of the total output (1/2 inch due to the large target surface It is needed in many occasions, especially in the field of scientific research; 1/4-inch CCD sensor accounts for 60% of the total output. In other words, the 1/2 inch CCD sensor with a large target size still has a great growth. The output of a 1/4-inch CCD sensor is lower than that of a 1/3-inch CCD sensor.
(2) The development of high-precision, multi-standard CCD sensors has reduced the image size of various CCD sensors, but the number of pixels has increased from the early 512 (H) × 596 (V) to 795 (H) × 596 (V) has developed even more than megapixel CCD sensors. In order to improve the resolving power in the horizontal direction and in the vertical direction, it has progressed from the usual interlace scanning to the progressive scanning format.
(3) Reducing the working voltage of the CCD sensor and reducing the power consumption The CCD camera developed at the initial stage has +24V, +22V, +17V, and +5V, and the current general purpose is +12V. In order to cooperate with the application of PC camera and network image transmission, the two operating voltages are mainly +12V and +5V.
(4) Improving the manufacturing efficiency of CCD cameras To reduce the manufacturing cost of CCD cameras and achieve high-speed automated production, manufacturers are pursuing a compact structure and are committed to the miniaturization of CCD cameras, that is, improved from DipOnBoard (DOB) to process Tin Optoelectronics. (COB) Chip mounting method for connecting IC chips on the board. So far, MultiChipModule (MCM) multichip integrated modular manufacturing technology has been implemented.
(5) Digitization of CCD camera When manufacturing a CCD camera, DSP digital processing is gradually implemented from the analog simulation system of the past, and various parameters of the CCD camera, especially the color CCD camera, can be quantified by means of an electronic computer and a dedicated software system. Adjustment can ensure the optimization of the CCD camera performance indicators and the quantitative modification of parameters under special conditions of use.